Product Description

Is a suitable precision electronics lead-free interconnect application solutions, such as POP laminated chip connection, flip chip connection, ball or connection, BGA/CSP rework/repair.
But under air and nitrogen reflow, in Cu - OSP solder surface and excellent weldability of Au/Ni coating surface,
Bright spot, no residue. No clean.
In compliance with RoHS and halogen free.
 
Help the solder paste type
ROL0

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