1, suitable
This specification is applicable to for PoP, SIP, BGA encapsulation using water-soluble solder paste.
Is a highly active, washing type of solder paste, can provide bright, smooth and bright spot, the residual after reflow
For material can dissolve in water, no residue after cleaning. Full compliance with RoHS and halogen free instructions, and do not contain substances Reach regulation.
This product is suitable for printing process.
2, the characteristics of
Suitable for reflow lead-free alloy under 250 ℃, with excellent heat resistance
In Cu - OSP solder surface and Au/Ni coating on the surface of excellent weldability
Highly active, good wettability, residue can be completely dissolved in water, no residue after cleaning
The rheological properties of superior, the good soldering invasive, low volatility
Do not contain halogen
3. The composition
Solvent additive agent surfactants ?
