Copper core ball between the chip and the substrate to form a connection bump, the bump core copper ball can maintain the stability of the package space and mitigate the external impact, so that it has become an excellent solution for 3D stacking package, but also in the field of narrow-pitch package has some applications. Widely used in new electronic chip packaging and POP process.
Features.
1. More precise size and tolerance control.
2. Excellent electrical and thermal conductivity.
3. Stable packaging space.
4. Low electromigration.
Applications.
POP packages, replacing high leaded solder balls in some cases, strict requirements on the size of solder joints after packaging.
Advantages: Stricter dimensional and roundness control, lower solder porosity, more thoughtful customized service, faster after-sales response.
Cu core solder ball has possibility that is used same solder ball process.
The melting point of copper core is over 1,000℃, so it keeps the stand off after reflow.
solder plating: SAC305
Size:
0.1mm-0.45mm
